Welcome to the first issue of our free company newsletter giving you insight into our current business as well as our activities across the globe. Should you wish to obtain more detailed information about a specific topic you may contact your local sales representative who will be gladly at your assistance.

With best regards,
Besi

Die Bonder 2100 FC for Your Mass Production Flip Chip Needs

Flip chip bonding on leadframes and low cost substrates is seeing fast growth. Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders – an aggressive approach to driving down the cost of flip chip assembly, both in investment and operating expenditure.

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TTT For Customised RFID Solutions

There is no single company in the world that can offer a total solution for RFID tag manufacturing, but there are best-in-class technology providers that together offer best-in-class total manufacturing solutions!

TTT™ ("Triple-T" – Total Tag Technology™) is a technology partnership program which offers total turnkey solutions for the manufacturing of RFID inlays, tags and related products.

Best-in-class technology providers in the field of RFID tag manufacturing are committed to the TTT™-partnership program in order to provide  customised TTT™-solutions customers.
 

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BE Semiconductor Industries Announces 2009 Third Quarter Results: Significant Revenue and Order Improvement

On October 29, 200, BE Semiconductor Industries N.V. ("the Company" or "Besi") (Euronext: BESI), announced its financial results for the third quarter ended September 30, 2009.

Highlights Third Quarter 2009

  • Revenues increased by 59.7% to € 48.7 million vs. € 30.5 million in Q2-2009 due primarily to increased die bonding shipments and improved industry conditions
  • Orders up € 15.4 million or 41.1% vs. Q2-2009 as growth experienced in entire assembly portfolio
  • Net loss of € 3.2 million in Q3-2009 including net gain of € 2.7 million as compared to net income of € 31.5 million in Q2-2009 including net gain of € 42.4 million primarily related to Esec acquisition
  • Solid financial position maintained at September 30, 2009:
    - Cash of € 68.0 million. Net cash of € 14.3 million
    - € 49.2 million cash in excess of bank/lease debt

Strategic Agenda and Outlook

  • Hungarian die bonding facility sold. Asian production transfer continues
  • Esec update: Favorable revenue, order and profit development trends. 30% headcount reduction achieved. Integration on track
  • Further reduction of adjusted net loss for Q4-2009 anticipated.
     
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Spotlights - Besi's Customer Magazine

Get your free copy of this year's issue of Besi's customer magazine featuring:

  • Flip Chip by Datacon
  • Bleed free QFN molding
  • Copper wire bonding
  • Cell Plating Line by Meco
  • Slot Ground Comb Punches
  • Saw Blade Treatment

 

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